Metals | Free Full-Text | Temperature and Stress Simulation of 4H-SiC during Laser-Induced Silicidation for Ohmic Contact Generation
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Materials Processing: KABRA laser-based SiC wafer slicing quadruples productivity | Laser Focus World
Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes - ScienceDirect
Disco develops laser ingot slicing method to speed SiC wafer production and cut material loss
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Laser-induced phase separation of silicon carbide | Nature Communications
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Calculated laser characteristics of membrane lasers on SiC a, Optical... | Download Scientific Diagram
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